Yasir Abdul Quadir
Lee Maltings, Prospect Row
Cork, Cork NA
- To work in mechanical and thermal reliability section of a
good IC Packaging company
Research Officer, USM, Malaysia
August 1996 - May 1998
- Thermal and thermo-mechanical management of Electronic Packages
- Setting up a thermal cooling lab
NMRC, UCC, Ireland - Ph.D. (currently pursuing) Microelectronics
USM, Malaysia - MS 1996, Mechanical Eng.
Jamia Millia Islamia, India - B.Sc.(eng.) 1994, Mechanical Eng.
Member, International Microelectronics and Packaging Society